Patent Assignment Details
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Reel/Frame: | 034299/0534 | |
| Pages: | 3 |
| | Recorded: | 11/19/2014 | | |
Attorney Dkt #: | 2515.0464 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/18/2016
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Application #:
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14548064
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Filing Dt:
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11/19/2014
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Publication #:
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Pub Dt:
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05/21/2015
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Title:
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Semiconductor Device and Method of Forming Wire Bondable Fan-Out EWLB Package
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Assignee
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10 ANG MO KIO STREET 65 |
#05-17/20 TECHPOINT |
SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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PATENT LAW GROUP: ATKINS AND ASSOCIATES
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55 N. ARIZONA PLACE
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SUITE 104
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CHANDLER, AZ 85225
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