Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 065745/0535 | |
| Pages: | 5 |
| | Recorded: | 12/01/2023 | | |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
9
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Patent #:
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Issue Dt:
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08/01/2006
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Application #:
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10792472
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Filing Dt:
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03/03/2004
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Publication #:
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Pub Dt:
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09/08/2005
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Title:
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DECOUPLING OF ACTUATORS FOR POSITIONING AN OBJECT
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Patent #:
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Issue Dt:
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08/21/2007
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Application #:
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11031024
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Filing Dt:
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01/07/2005
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Publication #:
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Pub Dt:
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07/13/2006
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Title:
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APPARATUS AND METHOD FOR ALIGNING DEVICES ON CARRIERS
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Patent #:
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Issue Dt:
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10/23/2012
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Application #:
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11459503
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Filing Dt:
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07/24/2006
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Publication #:
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Pub Dt:
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01/24/2008
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Title:
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AUTOMATIC LEVEL ADJUSTMENT FOR DIE BONDER
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Patent #:
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Issue Dt:
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01/25/2011
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Application #:
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11469996
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Filing Dt:
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09/05/2006
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Publication #:
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Pub Dt:
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03/06/2008
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Title:
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IMAGE CAPTURING FOR PATTERN RECOGNITION OF ELECTRONIC DEVICES
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Patent #:
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Issue Dt:
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10/13/2009
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Application #:
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11550866
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Filing Dt:
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10/19/2006
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Publication #:
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Pub Dt:
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04/24/2008
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Title:
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LINEAR MOTOR HAVING DUAL COIL CONFIGURATION
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Patent #:
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Issue Dt:
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06/15/2010
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Application #:
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11952296
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Filing Dt:
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12/07/2007
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Publication #:
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Pub Dt:
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06/11/2009
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Title:
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DISPENSING SOLDER FOR MOUNTING SEMICONDUCTOR CHIPS
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Patent #:
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Issue Dt:
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09/06/2011
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Application #:
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12130386
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Filing Dt:
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05/30/2008
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Publication #:
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Pub Dt:
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12/03/2009
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Title:
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METHOD OF BONDING SEMICONDUCTOR DEVICES UTILIZING SOLDER BALLS
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Patent #:
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Issue Dt:
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12/21/2010
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Application #:
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12258675
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Filing Dt:
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10/27/2008
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Publication #:
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Pub Dt:
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04/29/2010
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Title:
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DIRECT DIE ATTACH UTILIZING HEATED BOND HEAD
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Patent #:
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Issue Dt:
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12/04/2012
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Application #:
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12366275
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Filing Dt:
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02/05/2009
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Publication #:
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Pub Dt:
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08/05/2010
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Title:
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SYSTEM FOR MAINTAINING THERMAL STABILITY OF A MOTION STAGE
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Assignee
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| 2 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768924 |
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Correspondence name and address
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CPA GLOBAL LIMITED
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LIBERATION HOUSE
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CASTLE STREET
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ST HELIER, JE1 1BL JERSEY
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