Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 059327/0536 | |
| Pages: | 4 |
| | Recorded: | 03/21/2022 | | |
| Attorney Dkt #: | 127908-5011-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/04/2024
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Application #:
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17762219
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Filing Dt:
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03/21/2022
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Publication #:
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Pub Dt:
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10/27/2022
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Title:
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THERMOPLASTIC RESIN COMPOSITION AND MOLDED ARTICLE THEREOF
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Assignee
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| 128, YEOUI-DAERO, YEONGDEUNGPO-GU |
| SEOUL, KOREA, REPUBLIC OF 07336 |
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Correspondence name and address
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COLLIN W. PARK
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MORGAN, LEWIS & BOCKIUS LLP
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1111 PENNSYLVANIA AVE, NW
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WASHINGTON, DC 20004
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06/04/2024 02:53 AM
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