Patent Assignment Details
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| Reel/Frame: | 056497/0538 | |
| Pages: | 7 |
| | Recorded: | 06/10/2021 | | |
| Attorney Dkt #: | 038616-8614.US00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17343942
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Filing Dt:
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06/10/2021
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Publication #:
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Pub Dt:
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12/15/2022
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Title:
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INTERCONNECTION STRUCTURE FOR INTEGRATED CIRCUIT PACKAGE AND THE METHOD THEREOF
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Assignee
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| 79 GREAT OAKS BLVD |
| SAN JOSE, CALIFORNIA 95119 |
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Correspondence name and address
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PERKINS COIE LLP
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P.O.BOX 1247
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PATENT-SEA
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SEATTLE, WA 98111
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06/08/2024 06:30 AM
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