Patent Assignment Details
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| Reel/Frame: | 026196/0540 | |
| Pages: | 3 |
| | Recorded: | 04/28/2011 | | |
| Attorney Dkt #: | LOUI.12370 |
| Conveyance: | MERGER (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/07/2011
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Application #:
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12188663
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Filing Dt:
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08/08/2008
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Publication #:
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Pub Dt:
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02/12/2009
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Title:
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PACKAGING SUBSTRATE HAVING ELECTRICAL CONNECTION STRUCTURE AND METHOD FOR FABRICATING THE SAME
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Assignee
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| NO. 38 HSING PONG RD., KWEI SAN INDUSTRIAL ZONE |
| TAOYUAN, TAIWAN |
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Correspondence name and address
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ALBERT L. SCHMEISER
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18 E. UNIVERSITY DRIVE, STE. 101
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MESA, AZ 85201
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