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Total properties:
27
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Patent #:
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Issue Dt:
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04/21/2015
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Application #:
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13931325
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Filing Dt:
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06/28/2013
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Publication #:
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Pub Dt:
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01/01/2015
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Title:
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LEADLESS PACKAGES AND METHOD OF MANUFACTURING SAME
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Patent #:
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Issue Dt:
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04/17/2018
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Application #:
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14293274
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Filing Dt:
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06/02/2014
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Publication #:
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Pub Dt:
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12/03/2015
| | | | |
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Title:
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METHOD FOR MAKING SEMICONDUCTOR DEVICE WITH LEAD FRAME MADE FROM TOP AND BOTTOM COMPONENTS AND RELATED DEVICES
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Patent #:
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Issue Dt:
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11/08/2016
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Application #:
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14293364
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Filing Dt:
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06/02/2014
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Publication #:
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Pub Dt:
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12/03/2015
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Title:
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SEMICONDUCTOR DEVICE WITH ENCAPSULATED LEAD FRAME CONTACT AREA AND RELATED METHODS
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Patent #:
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Issue Dt:
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02/09/2016
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Application #:
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14294875
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Filing Dt:
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06/03/2014
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Publication #:
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Pub Dt:
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12/03/2015
| | | | |
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Title:
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SUPPORT STRUCTURE FOR STACKED INTEGRATED CIRCUIT DIES
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Patent #:
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Issue Dt:
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10/20/2015
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Application #:
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14449492
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Filing Dt:
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08/01/2014
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Title:
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SEMICONDUCTOR DEVICE WITH LEAD FRAME CONTACT SOLDER BALLS AND RELATED METHODS
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|
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Patent #:
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Issue Dt:
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04/26/2016
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Application #:
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14566826
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Filing Dt:
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12/11/2014
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Title:
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INTEGRATED CIRCUIT DEVICE HAVING EXPOSED CONTACT PADS AND LEADS SUPPORTING THE INTEGRATED CIRCUIT DIE AND METHOD OF FORMING THE DEVICE
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Patent #:
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Issue Dt:
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02/20/2018
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Application #:
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14582581
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Filing Dt:
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12/24/2014
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Publication #:
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Pub Dt:
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06/30/2016
| | | | |
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Title:
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SEMICONDUCTOR PACKAGE WITH CANTILEVER PADS
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Patent #:
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Issue Dt:
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04/18/2017
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Application #:
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14672664
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Filing Dt:
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03/30/2015
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Publication #:
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Pub Dt:
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10/06/2016
| | | | |
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Title:
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SEMICONDUCTOR DEVICE WITH SLOPED SIDEWALL AND RELATED METHODS
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Patent #:
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Issue Dt:
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11/14/2017
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Application #:
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14674069
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Filing Dt:
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03/31/2015
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Publication #:
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Pub Dt:
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10/06/2016
| | | | |
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Title:
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SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE CLIP WITH FLEXIBLE LEADS AND RELATED METHODS
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Patent #:
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Issue Dt:
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01/03/2017
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Application #:
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14754143
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Filing Dt:
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06/29/2015
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Publication #:
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Pub Dt:
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12/29/2016
| | | | |
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Title:
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SEMICONDUCTOR PACKAGES SEPARATED USING A SACRIFICIAL MATERIAL
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Patent #:
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Issue Dt:
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12/19/2017
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Application #:
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14788303
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Filing Dt:
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06/30/2015
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Publication #:
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Pub Dt:
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01/05/2017
| | | | |
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Title:
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LEADFRAME PACKAGE WITH STABLE EXTENDED LEADS
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|
|
|
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Patent #:
|
|
Issue Dt:
|
12/12/2017
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Application #:
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14861648
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Filing Dt:
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09/22/2015
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Publication #:
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Pub Dt:
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05/26/2016
| | | | |
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Title:
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PACKAGE FOR SEMICONDUCTOR DEVICES SENSITIVE TO MECHANICAL AND THERMO-MECHANICAL STRESSES, SUCH AS MEMS PRESSURE SENSORS
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Patent #:
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Issue Dt:
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12/12/2017
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Application #:
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14945291
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Filing Dt:
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11/18/2015
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Publication #:
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Pub Dt:
|
05/18/2017
| | | | |
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Title:
|
SEMICONDUCTOR PACKAGE WITH INTEGRATED HEATSINK
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|
|
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Patent #:
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|
Issue Dt:
|
11/21/2017
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Application #:
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14982018
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Filing Dt:
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12/29/2015
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Publication #:
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Pub Dt:
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06/29/2017
| | | | |
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Title:
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ELECTRONIC PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING AND ASSOCIATED METHOD
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|
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Patent #:
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Issue Dt:
|
09/12/2017
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Application #:
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15068752
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Filing Dt:
|
03/14/2016
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Publication #:
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Pub Dt:
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09/14/2017
| | | | |
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Title:
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METHOD FOR MAKING A SHIELDED INTEGRATED CIRCUIT (IC) PACKAGE WITH AN ELECTRICALLY CONDUCTIVE POLYMER LAYER
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|
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Patent #:
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Issue Dt:
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12/12/2017
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Application #:
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15181116
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Filing Dt:
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06/13/2016
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Publication #:
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Pub Dt:
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12/14/2017
| | | | |
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Title:
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STACKED SEMICONDUCTOR PACKAGE WITH COMPLIANT CORNERS ON FOLDED SUBSTRATE
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|
|
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Patent #:
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|
Issue Dt:
|
12/04/2018
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Application #:
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15281800
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Filing Dt:
|
09/30/2016
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|
Publication #:
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Pub Dt:
|
04/05/2018
| | | | |
|
Title:
|
TAPELESS LEADFRAME PACKAGE WITH UNDERSIDE RESIN AND SOLDER CONTACT
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|
|
|
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Patent #:
|
|
Issue Dt:
|
01/14/2020
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Application #:
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15408979
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Filing Dt:
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01/18/2017
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Publication #:
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Pub Dt:
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07/19/2018
| | | | |
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Title:
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DIE WITH METALLIZED SIDEWALL AND METHOD OF MANUFACTURING
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|
|
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Patent #:
|
|
Issue Dt:
|
04/24/2018
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Application #:
|
15474904
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Filing Dt:
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03/30/2017
|
|
Title:
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FLOW OVER WIRE DIE ATTACH FILM AND CONDUCTIVE MOLDING COMPOUND TO PROVIDE AN ELECTROMAGNETIC INTERFERENCE SHIELD FOR A SEMICONDUCTOR DIE
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|
|
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Patent #:
|
|
Issue Dt:
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11/13/2018
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Application #:
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15594351
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Filing Dt:
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05/12/2017
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Publication #:
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Pub Dt:
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11/15/2018
| | | | |
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Title:
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PACKAGE WITH BACKSIDE PROTECTIVE LAYER DURING MOLDING TO PREVENT MOLD FLASHING FAILURE
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|
|
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Patent #:
|
|
Issue Dt:
|
09/18/2018
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Application #:
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15610088
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Filing Dt:
|
05/31/2017
|
|
Title:
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QFN PRE-MOLDED LEADFRAME HAVING A SOLDER WETTABLE SIDEWALL ON EACH LEAD
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/09/2019
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Application #:
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15801022
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Filing Dt:
|
11/01/2017
|
|
Publication #:
|
|
Pub Dt:
|
03/08/2018
| | | | |
|
Title:
|
LEADFRAME PACKAGE WITH STABLE EXTENDED LEADS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/08/2022
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Application #:
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15876046
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Filing Dt:
|
01/19/2018
|
|
Publication #:
|
|
Pub Dt:
|
05/24/2018
| | | | |
|
Title:
|
MANUFACTURING METHOD FOR SEMICONDUCTOR PACKAGE WITH CANTILEVER PADS
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/21/2020
|
Application #:
|
16107807
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Filing Dt:
|
08/21/2018
|
|
Publication #:
|
|
Pub Dt:
|
12/13/2018
| | | | |
|
Title:
|
QFN PRE-MOLDED LEADFRAME HAVING A SOLDER WETTABLE SIDEWALL ON EACH LEAD
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|
|
|
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Patent #:
|
|
Issue Dt:
|
12/22/2020
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Application #:
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16203217
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Filing Dt:
|
11/28/2018
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|
Publication #:
|
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Pub Dt:
|
03/28/2019
| | | | |
|
Title:
|
TAPELESS LEADFRAME PACKAGE WITH UNDERSIDE RESIN AND SOLDER CONTACT
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|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/06/2020
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Application #:
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16249612
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Filing Dt:
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01/16/2019
|
|
Publication #:
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Pub Dt:
|
05/16/2019
| | | | |
|
Title:
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Leadframe having a Conductive Layer Protruding through a Lead Recess
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|
|
|
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Patent #:
|
|
Issue Dt:
|
02/02/2021
|
Application #:
|
16712789
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Filing Dt:
|
12/12/2019
|
|
Publication #:
|
|
Pub Dt:
|
04/30/2020
| | | | |
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Title:
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QFN PRE-MOLDED LEADFRAME HAVING A SOLDER WETTABLE SIDEWALL ON EACH LEAD
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