Patent Assignment Details
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| Reel/Frame: | 017244/0553 | |
| Pages: | 3 |
| | Recorded: | 11/15/2005 | | |
| Attorney Dkt #: | LEE.046 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11272740
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Filing Dt:
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11/15/2005
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Publication #:
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Pub Dt:
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05/18/2006
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Title:
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BGA package having substrate with exhaust hole
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Assignee
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| 26 CHIN 3RD ROAD |
| NANTZE EXPORT PROCESSING ZONE |
| KAOSHIUNG, TAIWAN |
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Correspondence name and address
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ANDREW J. TELESZ, JR.
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VOLENTINE FRANCOS & WHITT, P.L.L.C.
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11951 FREEDOM DRIVE, SUITE 1260
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RESTON, VA 20190
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