Patent Assignment Details
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| Reel/Frame: | 014625/0556 | |
| Pages: | 2 |
| | Recorded: | 10/16/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/16/2006
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Application #:
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10688689
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Filing Dt:
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10/16/2003
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Publication #:
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Pub Dt:
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04/21/2005
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Title:
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METHOD AND STRUCTURE FOR SELF HEALING CRACKS IN UNDERFILL MATERIAL BETWEEN AN I/C CHIP AND A SUBSTRATE BONDED TOGETHER WITH SOLDER BALLS
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Assignee
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| NEW ORCHARD ROAD |
| A NEW YORK CORPORATION |
| ARMONK, NEW YORK 10504 |
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Correspondence name and address
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DRIGGS, LUCAS, BRUBAKER & HOGG CO., LPA
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WILLIAM N. HOGG
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8522 EAST AVENUE
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MENTOR, OH 44060
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