Patent Assignment Details
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| Reel/Frame: | 056610/0556 | |
| Pages: | 6 |
| | Recorded: | 06/22/2021 | | |
| Attorney Dkt #: | T92514US01 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/26/2023
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Application #:
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17353805
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Filing Dt:
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06/21/2021
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Publication #:
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Pub Dt:
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12/22/2022
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Title:
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SEMICONDUTOR PACKAGE SUBSTRATE WITH DIE CAVITY AND REDISTRIBUTION LAYER
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Assignee
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| 12500 TI BOULEVARD |
| M/S 3999 |
| DALLAS, TEXAS 75243 |
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Correspondence name and address
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TEXAS INSTRUMENTS INCORPORATED
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P.O. BOX 655474
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MS 3999
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DALLAS, 75243 UNITED STATES
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