Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 059610/0556 | |
| Pages: | 3 |
| | Recorded: | 04/15/2022 | | |
| Attorney Dkt #: | 20-TPY0801US02/812063.514 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17700259
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Filing Dt:
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03/21/2022
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Publication #:
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Pub Dt:
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10/06/2022
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Title:
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SEMICONDUCTOR DEVICE PACKAGE WITH CONDUCTIVE VIAS AND METHOD OF MANUFACTURING
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Assignee
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| 28 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569508 |
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Correspondence name and address
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SEED INTELLECTUAL PROPERTY LAW GROUP LLP
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701 FIFTH AVENUE
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SUITE 5400
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SEATTLE, WA 98104
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