Patent Assignment Details
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| Reel/Frame: | 061269/0558 | |
| Pages: | 2 |
| | Recorded: | 09/30/2022 | | |
| Attorney Dkt #: | Q95622VN06 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17957138
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Filing Dt:
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09/30/2022
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Publication #:
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Pub Dt:
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05/18/2023
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Title:
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TWO-SIDED INTERCONNECTED EMBEDDED CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR
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Assignee
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| FPC FACTORY, 3209 NORTH ZHUFENG AVENUE, DOUMEN, ZHUHAI, |
| GUANGDONG, CHINA 519175 |
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Correspondence name and address
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THE PL LAW GROUP, PLLC
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13800 COPPERMINE ROAD
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FL 1-3
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HERNDON,, VA 20171
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