Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 028832/0560 | |
| Pages: | 5 |
| | Recorded: | 08/22/2012 | | |
| Attorney Dkt #: | TIPI 5.2-033 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT ADDRESS OF RECEIVING PARTY PREVIOUSLY RECORDED ON REEL 028708, FRAME 0649. |
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Total properties:
4
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Patent #:
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Issue Dt:
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11/13/2007
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Application #:
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11186840
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Filing Dt:
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07/22/2005
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Publication #:
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Pub Dt:
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01/26/2006
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Title:
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WAFER-LEVELED CHIP PACKAGING STRUCTURE AND METHOD THEREOF
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Patent #:
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Issue Dt:
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05/05/2009
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Application #:
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11785612
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Filing Dt:
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04/19/2007
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Publication #:
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Pub Dt:
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08/23/2007
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Title:
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WAFER-LEVELED CHIP PACKAGING STRUCTURE AND METHOD THEREOF
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Patent #:
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Issue Dt:
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11/20/2012
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Application #:
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11905869
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Filing Dt:
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10/05/2007
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Publication #:
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Pub Dt:
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02/07/2008
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Title:
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SEMICONDUCTOR PACKAGE DEVICE
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Patent #:
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Issue Dt:
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11/19/2013
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Application #:
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13533251
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Filing Dt:
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06/26/2012
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Publication #:
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Pub Dt:
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10/25/2012
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Title:
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WAFER-LEVELED CHIP PACKAGING STRUCTURE AND METHOD THEREOF
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Assignee
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| 2702 ORCHARD PARKWAY |
| SAN JOSE, CALIFORNIA 95134 |
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Correspondence name and address
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DARYL K. NEFF
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LERNER, DAVID, LITTENBERG, KRUMHOLZ &
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MENTLIK, LLP
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600 SOUTH AVENUE WEST
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WESTFIELD, NJ 07090
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