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Patent Assignment Details
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Reel/Frame:018428/0561   Pages: 9
Recorded: 10/24/2006
Attorney Dkt #:64470.000025
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
07/06/2010
Application #:
11550640
Filing Dt:
10/18/2006
Publication #:
Pub Dt:
04/26/2007
Title:
TECHNIQUE FOR INCREASING THE COMPLIANCE OF LEAD-FREE SOLDERS CONTAINING SILVER
Assignors
1
Exec Dt:
10/17/2006
2
Exec Dt:
10/17/2006
3
Exec Dt:
10/17/2006
Assignee
1
1676 LINCOLN AVENUE
UTICA, NEW YORK 13502
Correspondence name and address
HUNTON & WILLIAMS LLP
1900 K STREET, NW,
SUITE1200
WASHINGTON, DC 20006-1109

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