Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 025576/0561 | |
| Pages: | 3 |
| | Recorded: | 01/04/2011 | | |
| Attorney Dkt #: | ILIP0039USA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12983895
|
Filing Dt:
|
01/04/2011
|
|
Publication #:
|
|
Pub Dt:
|
06/14/2012
| | | | |
|
Title:
|
BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT COMPRISING A PLURALITY OF BONDING PAD STRUCTURES
|
|
|
Assignee
|
|
|
|
|
| 8F., NO.38, TAIYUAN ST., JHUBEI CITY |
| HSINCHU COUNTY, TAIWAN |
|
|
Correspondence name and address
|
| |
WINSTON HSU
|
| |
P.O.BOX 506
|
| |
MERRIFIELD, VA 22116
|
Search Results as of:
05/24/2024 09:56 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
