Patent Assignment Details
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Reel/Frame: | 034273/0562 | |
| Pages: | 4 |
| | Recorded: | 11/26/2014 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/09/2017
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Application #:
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14775550
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Filing Dt:
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09/11/2015
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Publication #:
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Pub Dt:
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11/24/2016
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PCT #:
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US2014065313
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Title:
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INTEGRATED CIRCUIT PACKAGING TECHNIQUES AND CONFIGURATIONS FOR SMALL FORM-FACTOR OR WEARABLE DEVICES
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Assignee
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2200 MISSION COLLEGE BOULEVARD |
SANTA CLARA, CALIFORNIA 95054 |
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Correspondence name and address
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SCHWABE, WILLIAMSON & WYATT, P.C.
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1211 SW 5TH AVENUE, SUITE 1600
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PORTLAND, OR 97204
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06/06/2024 08:45 AM
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