Patent Assignment Details
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| Reel/Frame: | 062400/0563 | |
| Pages: | 8 |
| | Recorded: | 01/17/2023 | | |
| Attorney Dkt #: | SH21450YY |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18155691
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Filing Dt:
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01/17/2023
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Publication #:
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Pub Dt:
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03/07/2024
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Title:
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ATOMIC LAYER ETCHING METHOD USING LIGAND EXCHANGE REACTION
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Assignees
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| 2091, GYEONGCHUNG-DAERO, BUBAL-EUB |
| GYEONGGI-DO |
| ICHEON-SI, KOREA, REPUBLIC OF 17336 |
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| 261 WONNAMSANDAN-RO, WONNAM-MYEON |
| CHUNGCHEONGBUK-DO |
| EUMSEONG-GUN, KOREA, REPUBLIC OF 27721 |
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Correspondence name and address
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AGORA LAW GROUP, PLLC
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22722 29TH DR SE
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SUITE 100
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BOTHELL, WA 98021
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06/14/2024 08:44 AM
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