Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 028845/0564 | |
| Pages: | 8 |
| | Recorded: | 08/24/2012 | | |
| Attorney Dkt #: | P37109PCT |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13997577
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Filing Dt:
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06/24/2013
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Publication #:
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Pub Dt:
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05/01/2014
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PCT #:
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US2012031486
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Title:
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PROCESS AND MATERIAL FOR PREVENTING DELETERIOUS EXPANSION OF HIGH ASPECT RATIO COPPER FILLED THROUGH SILICON VIAS (TSVS)
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Assignee
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| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95052 |
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Correspondence name and address
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FINCH & MALONEY PLLC
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C/O CPA GLOBAL
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P.O. BOX 52050
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MINNEAPOLIS, MN 55402
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