Patent Assignment Details
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| Reel/Frame: | 033492/0564 | |
| Pages: | 10 |
| | Recorded: | 08/07/2014 | | |
| Attorney Dkt #: | 95775(71987) |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE'S NAME PREVIOUSLY RECORDED ON REEL 033287 FRAME 0853. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNEE'S NAME SHOULD BE CHANGED FROM SILICONWARE PRECISIONS INDSUTRIES CO., LTD. TO SILICONWARE PRECISION INDUSTRIES CO., LTD.. |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14328092
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Filing Dt:
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07/10/2014
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Publication #:
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Pub Dt:
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08/20/2015
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Title:
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FLIP-CHIP PACKAGING SUBSTRATE, FLIP-CHIP PACKAGE AND FABRICATION METHODS THEREOF
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Assignee
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| NO. 123, SEC. 3, DA FONG ROAD, TANTZU |
| TAICHUNG, TAIWAN |
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Correspondence name and address
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EDWARDS WILDMAN PALMER LLP
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P.O. BOX 55874
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BOSTON, MA 02205
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