Patent Assignment Details
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Reel/Frame: | 031559/0565 | |
| Pages: | 4 |
| | Recorded: | 11/07/2013 | | |
Attorney Dkt #: | KBKAS.P005 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14059633
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Filing Dt:
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10/22/2013
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Publication #:
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Pub Dt:
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10/16/2014
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Title:
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COPPER ALLOY MATERIAL FOR ELECTRICAL AND ELECTRONIC COMPONENTS AND METHOD OF PREPARING THE SAME
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Assignee
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POONGSAN BLDG., 23 |
CHUNGJEONG-RO, SEODAEMUN-GU |
SEOUL 120-013, KOREA, REPUBLIC OF |
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Correspondence name and address
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ANDREW F. YOUNG, ESQ.
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LACKENBACH SIEGEL BUILDING
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1 CHASE ROAD
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SCARSDALE, NY 10583
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