Patent Assignment Details
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Reel/Frame: | 057594/0567 | |
| Pages: | 4 |
| | Recorded: | 09/24/2021 | | |
Attorney Dkt #: | ZP146-0059-US-03 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/19/2023
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Application #:
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17448794
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Filing Dt:
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09/24/2021
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Publication #:
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Pub Dt:
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01/20/2022
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Title:
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MOLDED DIRECT BONDED AND INTERCONNECTED STACK
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Assignee
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3025 ORCHARD PARKWAY |
SAN JOSE, CALIFORNIA 95134 |
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Correspondence name and address
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SALINA DIAZ
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3025 ORCHARD PARKWAY
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C/O: INVENSAS BONDING TECHNOLOGIES, INC.
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SAN JOSE, CA 95134
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05/26/2024 02:34 PM
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