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Reel/Frame:032159/0568   Pages: 11
Recorded: 02/06/2014
Attorney Dkt #:ORA13-0836
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/02/2016
Application #:
14047910
Filing Dt:
10/07/2013
Publication #:
Pub Dt:
10/30/2014
Title:
HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER
Assignors
1
Exec Dt:
10/07/2013
2
Exec Dt:
10/07/2013
3
Exec Dt:
10/07/2013
4
Exec Dt:
10/07/2013
5
Exec Dt:
10/07/2013
6
Exec Dt:
10/09/2013
7
Exec Dt:
10/07/2013
8
Exec Dt:
10/07/2013
9
Exec Dt:
10/07/2013
10
Exec Dt:
10/07/2013
Assignee
1
500 ORACLE PARKWAY
MAIL STOP 5OP7
REDWOOD CITY, CALIFORNIA 94065
Correspondence name and address
A. RICHARD PARK
PARK, VAUGHAN, FLEMING & DOWLER LLP
2820 FIFTH STREET
DAVIS, CA 95618

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