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Patent Assignment Details
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Reel/Frame:010476/0570   Pages: 3
Recorded: 12/22/1999
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/19/2001
Application #:
09470070
Filing Dt:
12/22/1999
Title:
HEAT-DISSIPATING DEVICE FOR INTEGRATED CIRCUIT PACKAGE
Assignors
1
Exec Dt:
09/27/1999
2
Exec Dt:
09/27/1999
Assignee
1
NO. 123, SEC 3, DA FONG ROAD
TANTZU, TAICHUNG, TAIWAN R.O.C
Correspondence name and address
DIKE, BRONSTEIN, ROBERTS & CUSHMAN, LLP
PETER F. CORLESS
130 WATER STREET
BOSTON, MA 02109

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