Total properties:
203
Page
2
of
3
Pages:
1 2 3
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/20/2001
|
Application #:
|
09223471
|
Filing Dt:
|
12/30/1998
|
|
Title:
|
TRENCH STRUCTURE FOR ISOLATING SEMICONDUCTOR ELEMENTS AND METHOD FOR FORMING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/13/2001
|
Application #:
|
09223839
|
Filing Dt:
|
12/31/1998
|
|
Title:
|
SEMICONDUCTOR PACKAGE HAVING MULTI-DIES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/15/2002
|
Application #:
|
09233980
|
Filing Dt:
|
01/20/1999
|
|
Title:
|
MICROCIRCUIT DIE-SAWING PROTECTOR AND METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/12/2001
|
Application #:
|
09240422
|
Filing Dt:
|
01/29/1999
|
|
Title:
|
"PRINTED CIRCUIT BOARD FOR BALL GRID ARRAY SEMICONDUCTOR PACKAGES"
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/10/2001
|
Application #:
|
09240423
|
Filing Dt:
|
01/29/1999
|
|
Title:
|
METHOD OF MOLDING BALL GRID ARRAY SEMICONDUCTOR PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/12/2001
|
Application #:
|
09246574
|
Filing Dt:
|
02/08/1999
|
|
Title:
|
ELECTROSTATIC DISCHARGE PROTECTION PACKAGE AND METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/02/2001
|
Application #:
|
09262789
|
Filing Dt:
|
03/04/1999
|
|
Title:
|
METHOD FOR FORMING A MENTAL WIRING PATTERN ON A SEMICONDUCTOR DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/16/2001
|
Application #:
|
09287711
|
Filing Dt:
|
04/07/1999
|
|
Title:
|
THIN, STACKABLE SEMICONDUCTOR PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/31/2001
|
Application #:
|
09305170
|
Filing Dt:
|
05/04/1999
|
|
Title:
|
PRINTED CIRCUIT BOARD WITH OVAL SOLDER BALL LANDS FOR BGA SEMICONDUCTOR PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/08/2002
|
Application #:
|
09310660
|
Filing Dt:
|
05/12/1999
|
|
Title:
|
LOW-COST PRINTED CIRCUIT BOARD WITH INTEGRAL HEAT SINK FOR SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/14/2001
|
Application #:
|
09324710
|
Filing Dt:
|
06/03/1999
|
|
Title:
|
PLASTIC PACKAGE FOR AN OPTICAL INTEGRATED CIRCUIT DEVICE AND METHOD OF MAKING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/03/2001
|
Application #:
|
09343516
|
Filing Dt:
|
06/30/1999
|
|
Title:
|
SEMICONDUCTOR PACKAGE WITH AN IMPROVED LEADFRAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/01/2001
|
Application #:
|
09347794
|
Filing Dt:
|
07/06/1999
|
|
Title:
|
EPOXY RESIN COMPOSITION FOR BONDING SEMICONDUCTOR CHIPS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/08/2001
|
Application #:
|
09348772
|
Filing Dt:
|
07/07/1999
|
|
Title:
|
NEAR CHIP SIZE INTEGRATED CIRCUIT PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/10/2001
|
Application #:
|
09370600
|
Filing Dt:
|
08/09/1999
|
|
Title:
|
METHOD OF MAKING AN ELECTRONIC DEVICE PACKAGE AND LEADFRAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/23/2001
|
Application #:
|
09380243
|
Filing Dt:
|
08/30/1999
|
|
Title:
|
SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/19/2001
|
Application #:
|
09383022
|
Filing Dt:
|
08/25/1999
|
|
Title:
|
METHOD OF FORMING AN INTEGRATED CIRCUIT DEVICE PACKAGE USING A PLASTIC TAPE AS A BASE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/06/2002
|
Application #:
|
09385695
|
Filing Dt:
|
08/30/1999
|
|
Title:
|
METHOD FOR LAMINATING CIRCUIT PATTERN TAPE ON SEMICONDUCTOR WAFER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/10/2002
|
Application #:
|
09385696
|
Filing Dt:
|
08/30/1999
|
|
Title:
|
SURFACE ACOUSTICAL WAVE FLIP CHIP
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/12/2002
|
Application #:
|
09387377
|
Filing Dt:
|
08/30/1999
|
|
Title:
|
CIRCUIT PATTERN TAPE FOR WAFER-SCALE PRODUCTION OF CHIP SIZE SEMICONDUCTOR PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/20/2002
|
Application #:
|
09391792
|
Filing Dt:
|
09/08/1999
|
|
Title:
|
LEAD FRAME USED FOR THE FABRICATION OF SEMICONDUCTOR PACKAGES AND SEMICONDUCTOR PACKAGE FABRICATED USING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/24/2002
|
Application #:
|
09395875
|
Filing Dt:
|
09/14/1999
|
|
Title:
|
METHOD FOR MOLDING A LEADFRAME IN PLASTIC INTEGRATED CIRCUIT DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/06/2001
|
Application #:
|
09420065
|
Filing Dt:
|
10/18/1999
|
|
Title:
|
THIN LEADFRAME-TYPE SEMICONDUCTOR PACKAGE HAVING HEAT SINK WITH RECESS AND EXPOSED SURFACE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/30/2002
|
Application #:
|
09421454
|
Filing Dt:
|
10/19/1999
|
|
Title:
|
METHODS AND A DEVICE FOR HEAT TREATMENT A SEMICONDUCTOR WAFER HAVING DIFFERENT KINDS OF IMPURITIES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/12/2000
|
Application #:
|
09422008
|
Filing Dt:
|
10/20/1999
|
|
Title:
|
OPTICAL SENSOR ARRAY MOUNTING AND ALIGNMEMT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/08/2002
|
Application #:
|
09422027
|
Filing Dt:
|
10/20/1999
|
|
Title:
|
CHIP-SCALE SEMICONDUCTOR PACKAGE OF THE FAN-OUT TYPE AND METHOD OF MANUFACTURING SUCH PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/03/2002
|
Application #:
|
09422115
|
Filing Dt:
|
10/20/1999
|
|
Title:
|
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SUCH DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/18/2001
|
Application #:
|
09434546
|
Filing Dt:
|
11/05/1999
|
|
Title:
|
METHODS OF MAKING THIN INTEGRATED CIRCUIT DEVICE PACKAGES WITH IMPROVED THERMAL PERFORMANCE AND SUBSTRATES FOR MAKING THE PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/18/2001
|
Application #:
|
09437013
|
Filing Dt:
|
11/09/1999
|
|
Title:
|
CHIP-SIZE SEMICONDUCTOR PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/31/2001
|
Application #:
|
09437574
|
Filing Dt:
|
11/09/1999
|
|
Title:
|
INTEGRATED CIRCUIT PACKAGE HAVING ADHESIVE BEAD SUPPORTING PLANAR LID ABOVE PLANAR SUBSTRATE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/05/2002
|
Application #:
|
09439917
|
Filing Dt:
|
11/12/1999
|
|
Title:
|
CAVITY SEMICONDUCTOR PACKAGE WITH EXPOSED LEADS AND DIE PAD AND METHOD FOR MAKING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/09/2002
|
Application #:
|
09440808
|
Filing Dt:
|
11/15/1999
|
|
Title:
|
MICROMACHINE PACKAGE FABRICATION METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/30/2001
|
Application #:
|
09441115
|
Filing Dt:
|
11/17/1999
|
|
Title:
|
METHOD OF MOLDING PLASTIC SEMICONDUCTOR PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/10/2002
|
Application #:
|
09444035
|
Filing Dt:
|
11/19/1999
|
|
Title:
|
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING USING LEADFRAME HAVING LEAD LOCKS TO SECURE LEADS TO ENCAPSULANT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/28/2002
|
Application #:
|
09448538
|
Filing Dt:
|
11/22/1999
|
|
Title:
|
THIN IMAGE SENSOR PACKAGE FABRICATION METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/20/2001
|
Application #:
|
09452545
|
Filing Dt:
|
12/01/1999
|
|
Title:
|
CONDUCTIVE STRAP ATTACHMENT PROCESS THAT ALLOWS ELECTRICAL CONNECTOR BETWEEN AN INTEGRATED CIRCUITE DIE AND LEADFRAME.
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/24/2002
|
Application #:
|
09457505
|
Filing Dt:
|
12/08/1999
|
|
Title:
|
MOLDED IMAGE SENSOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/19/2002
|
Application #:
|
09457513
|
Filing Dt:
|
12/08/1999
|
|
Title:
|
MOLDED IMAGE SENSOR PACKAGE HAVING LENS HOLDER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/19/2002
|
Application #:
|
09457516
|
Filing Dt:
|
12/08/1999
|
|
Title:
|
SNAP LID IMAGE SENSOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/21/2002
|
Application #:
|
09457517
|
Filing Dt:
|
12/08/1999
|
|
Title:
|
METHOD OF FABRICATING IMAGE SENSOR PACKAGES IN AN ARRAY
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/24/2001
|
Application #:
|
09458033
|
Filing Dt:
|
12/08/1999
|
|
Title:
|
MOLDED WINDOW ARRAY FOR IMAGE SENSOR PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/23/2002
|
Application #:
|
09460175
|
Filing Dt:
|
12/10/1999
|
|
Title:
|
A MICROELECTRONIC DEVICE PACKAGE HAVING A HEAT SINK STRUCTURE FOR INCREASING THE THERMAL CONDUCTIVITY OF THE PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/09/2002
|
Application #:
|
09461523
|
Filing Dt:
|
12/14/1999
|
|
Title:
|
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/20/2001
|
Application #:
|
09484192
|
Filing Dt:
|
01/18/2000
|
|
Title:
|
Stackable package for an integrated circuit
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/02/2002
|
Application #:
|
09490317
|
Filing Dt:
|
01/24/2000
|
|
Title:
|
PACKAGE FOR STACKED INTEGRATED CIRCUITS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/15/2002
|
Application #:
|
09498144
|
Filing Dt:
|
02/04/2000
|
|
Title:
|
Making chip size semiconductor packages
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/10/2002
|
Application #:
|
09505395
|
Filing Dt:
|
02/16/2000
|
|
Title:
|
PRINTED CIRCUIT BOARD WITH HEAT SPREADER AND METHOD OF MAKING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/23/2002
|
Application #:
|
09513232
|
Filing Dt:
|
02/24/2000
|
|
Title:
|
LEADFRAME FOR MOLDED SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MADE USING THE LEADFRAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/03/2001
|
Application #:
|
09517362
|
Filing Dt:
|
03/02/2000
|
|
Title:
|
Method of forming trench for semiconductor device isolation
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/15/2002
|
Application #:
|
09523372
|
Filing Dt:
|
03/10/2000
|
|
Title:
|
Method of forming shallow trench isolation for preventing torn oxide
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/01/2002
|
Application #:
|
09536236
|
Filing Dt:
|
03/27/2000
|
|
Title:
|
ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES WITH CONDUCTIVE STRAPS
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/29/2002
|
Application #:
|
09548702
|
Filing Dt:
|
04/13/2000
|
|
Title:
|
ELECTROMAGNETIC INTERFERENCE SHIELD DEVICE AND METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/30/2001
|
Application #:
|
09558392
|
Filing Dt:
|
04/25/2000
|
|
Title:
|
Precision marking and singulation method
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/27/2002
|
Application #:
|
09558397
|
Filing Dt:
|
04/25/2000
|
|
Title:
|
PRECISION ALIGNED AND MARKED STRUCTURE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/16/2002
|
Application #:
|
09561180
|
Filing Dt:
|
04/27/2000
|
|
Title:
|
Moisture-resistant integrated circuit chip package and method
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/18/2002
|
Application #:
|
09565586
|
Filing Dt:
|
05/04/2000
|
|
Title:
|
MOISTURE-RESISTANT INTEGRATED CIRCUIT CHIP PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/06/2002
|
Application #:
|
09565881
|
Filing Dt:
|
05/05/2000
|
|
Title:
|
LONG WIRE IC PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/23/2002
|
Application #:
|
09566680
|
Filing Dt:
|
05/08/2000
|
|
Title:
|
STACKABLE PACKAGE WITH HEAT SINK
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/04/2001
|
Application #:
|
09566849
|
Filing Dt:
|
05/05/2000
|
|
Title:
|
Lowwire ic package fabrication method
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/27/2002
|
Application #:
|
09569716
|
Filing Dt:
|
05/11/2000
|
|
Title:
|
APPARATUS FOR ELECTRICALLY MOUNTING AN ELECTRONIC DEVICE TO A SUBSTRATE WITHOUT SOLDERING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/31/2002
|
Application #:
|
09574006
|
Filing Dt:
|
05/19/2000
|
|
Title:
|
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
05/28/2002
|
Application #:
|
09574541
|
Filing Dt:
|
05/19/2000
|
|
Title:
|
Semiconductor package and method for fabricating the same
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/10/2002
|
Application #:
|
09577692
|
Filing Dt:
|
05/22/2000
|
|
Title:
|
IMAGE SENSOR PACKAGE HAVING SEALED CAVITY OVER ACTIVE AREA
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/04/2002
|
Application #:
|
09585506
|
Filing Dt:
|
06/01/2000
|
|
Title:
|
REINFORCING SOLDER CONNECTIONS OF ELECTRONIC DEVICES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/13/2001
|
Application #:
|
09591705
|
Filing Dt:
|
06/09/2000
|
|
Title:
|
Making solder ball mounting pads on substrates
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/15/2002
|
Application #:
|
09593269
|
Filing Dt:
|
06/13/2000
|
|
Title:
|
Electronic device package and leadframe
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/03/2002
|
Application #:
|
09595851
|
Filing Dt:
|
06/16/2000
|
|
Title:
|
MOS TRANSISTOR THAT INHIBITS PUNCHTHROUGH
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/22/2002
|
Application #:
|
09607778
|
Filing Dt:
|
06/30/2000
|
|
Title:
|
LEADFRAME HAVING A MOLD INFLOW GROOVE AND METHOD FOR MAKING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/17/2002
|
Application #:
|
09608197
|
Filing Dt:
|
06/30/2000
|
|
Title:
|
LOW PROFILE PACKAGE FOR PLURAL SEMICONDUCTOR DIES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/10/2001
|
Application #:
|
09608502
|
Filing Dt:
|
06/30/2000
|
|
Title:
|
Flip-chip micromachine package fabrication method
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
03/12/2002
|
Application #:
|
09608678
|
Filing Dt:
|
06/29/2000
|
|
Title:
|
Electronic package having flip chip integrated circuit and passive chip component
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/18/2002
|
Application #:
|
09610314
|
Filing Dt:
|
07/05/2000
|
|
Title:
|
Wafer scale image sensor package
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/13/2002
|
Application #:
|
09615107
|
Filing Dt:
|
07/13/2000
|
|
Title:
|
PLASTIC INTERGRATED CIRCUIT PACKAGE AND METHOD AND LEADFRAME FOR MAKING THE PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/29/2002
|
Application #:
|
09620444
|
Filing Dt:
|
07/20/2000
|
|
Title:
|
SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR DIES AND BOND WIRES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/23/2002
|
Application #:
|
09631449
|
Filing Dt:
|
08/02/2000
|
|
Title:
|
SEMICONDUCTOR CHIP HAVING A RADIO-FREQUENCY IDENTIFICATION TRANSCEIVER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/03/2002
|
Application #:
|
09634496
|
Filing Dt:
|
08/08/2000
|
|
Title:
|
D-SORBITOL DEHYDROGENASE GENE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/22/2002
|
Application #:
|
09648946
|
Filing Dt:
|
08/23/2000
|
|
Title:
|
CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/18/2002
|
Application #:
|
09654978
|
Filing Dt:
|
09/05/2000
|
|
Title:
|
WAFER LEVEL PRODUCTION OF CHIP SIZE SEMICONDUCTOR PACKAGES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/18/2002
|
Application #:
|
09656349
|
Filing Dt:
|
09/06/2000
|
|
Title:
|
BICYCLE PASSENGER CARRIER
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/31/2002
|
Application #:
|
09687485
|
Filing Dt:
|
10/13/2000
|
|
Title:
|
SEMICONDUCTOR PACKAGE HAVING INCREASED SOLDER JOINT STRENGTH
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/05/2002
|
Application #:
|
09687532
|
Filing Dt:
|
10/13/2000
|
|
Title:
|
METHOD FOR MAKING A SEMICONDUCTOR PACKAGE HAVING IMPROVED DEFECT TESTING AND INCREASED PRODUCTION YIELD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/22/2002
|
Application #:
|
09693466
|
Filing Dt:
|
10/20/2000
|
|
Title:
|
Method of fabricating semiconductor device
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/29/2002
|
Application #:
|
09714682
|
Filing Dt:
|
11/15/2000
|
|
Title:
|
Flip chip on glass image sensor package fabrication method
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/22/2002
|
Application #:
|
09730721
|
Filing Dt:
|
12/06/2000
|
|
Title:
|
Making semiconductor packages with stacked dies and reinforced wire bonds
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/10/2002
|
Application #:
|
09752662
|
Filing Dt:
|
12/28/2000
|
|
Title:
|
SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD FOR MAKING THE PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/16/2002
|
Application #:
|
09754229
|
Filing Dt:
|
01/03/2001
|
|
Title:
|
METHOD FOR FORMING A BOND WIRE PRESSURE SENSOR DIE PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/13/2002
|
Application #:
|
09754239
|
Filing Dt:
|
01/03/2001
|
|
Title:
|
METHOD FOR FORMING A FLIP CHIP PRESSURE SENSOR DIE PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/27/2002
|
Application #:
|
09754393
|
Filing Dt:
|
01/03/2001
|
|
Title:
|
BOND WIRE PRESSURE SENSOR DIE PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/03/2002
|
Application #:
|
09770859
|
Filing Dt:
|
01/26/2001
|
|
Title:
|
SEMICONDUCTOR MODULE PACKAGE SUBSTRATE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/17/2002
|
Application #:
|
09770861
|
Filing Dt:
|
01/26/2001
|
|
Title:
|
SEMICONDUCTOR MODULE PACKAGE SUBSTRATE FABRICATION METHOD
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/05/2002
|
Application #:
|
09783797
|
Filing Dt:
|
02/14/2001
|
|
Title:
|
PRINTED CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/04/2002
|
Application #:
|
09797756
|
Filing Dt:
|
03/01/2001
|
|
Title:
|
METHOD OF SINGULATION USING LASER CUTTING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/16/2002
|
Application #:
|
09797759
|
Filing Dt:
|
03/01/2001
|
|
Title:
|
STRUCTURE INCLUDING ELECTRONIC COMPONENTS SINGULATED USING LASER CUTTING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
09/24/2002
|
Application #:
|
09804749
|
Filing Dt:
|
03/12/2001
|
|
Title:
|
MICROMIRROR DEVICE PACKAGE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
11/26/2002
|
Application #:
|
09812426
|
Filing Dt:
|
03/19/2001
|
|
Title:
|
SEMICONDUCTOR PACKAGE WITH WARPAGE RESISTANT SUBSTRATE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/20/2002
|
Application #:
|
09828396
|
Filing Dt:
|
04/06/2001
|
|
Title:
|
MAKING SEMICONDUCTOR DEVICES HAVING STACKED DIES WITH BIASED BACK SURFACES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/16/2002
|
Application #:
|
09839861
|
Filing Dt:
|
04/20/2001
|
|
Publication #:
|
|
Pub Dt:
|
08/16/2001
| | | | |
|
Title:
|
METHOD OF MAKING A PLASTIC PAKAGE FOR AN OPTICAL INTEGRATED CIRCUIT DEVICE
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
08/06/2002
|
Application #:
|
09866100
|
Filing Dt:
|
05/25/2001
|
|
Title:
|
ACTIVE HEAT SINK FOR COOLING A SEMICONDUCTOR CHIP
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
07/09/2002
|
Application #:
|
09884357
|
Filing Dt:
|
06/18/2001
|
|
Title:
|
METHOD AND APPARATUS FOR ATTACHING MULTIPLE METAL COMPONENTS TO INTEGRATED CIRCUIT MODULES
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/04/2002
|
Application #:
|
09916719
|
Filing Dt:
|
07/26/2001
|
|
Title:
|
METHOD FOR FORMING A REDUCED THICKNESS PACKAGED ELECTRONIC DEVICE
|
|
