Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 028439/0573 | |
| Pages: | 6 |
| | Recorded: | 06/25/2012 | | |
| Conveyance: | RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). |
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Total properties:
7
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Patent #:
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Issue Dt:
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01/03/1995
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Application #:
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08171696
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Filing Dt:
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12/22/1993
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Title:
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HYBRID CIRCUITS AND A METHOD OF MANUFACTURE
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Patent #:
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Issue Dt:
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05/06/1997
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Application #:
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08689388
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Filing Dt:
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08/12/1996
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Title:
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INVERTED CHIP BONDED MODULE WITH HIGH PACKAGING EFFICIENCY
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Patent #:
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Issue Dt:
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02/02/1999
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Application #:
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08767160
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Filing Dt:
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12/16/1996
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Title:
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INVERTED CHIP BONDED MODULE WITH HIGH PACKAGING EFFICIENCY
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Patent #:
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Issue Dt:
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08/11/1998
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Application #:
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08811114
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Filing Dt:
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03/03/1997
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Title:
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INVERTED CHIP BONDED MODULE WITH HIGH PACKAGING EFFICIENCY
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Patent #:
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Issue Dt:
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05/18/1999
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Application #:
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08906045
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Filing Dt:
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08/05/1997
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Title:
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PACKAGE FOR POWER SEMICONDUCTOR CHIPS
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Patent #:
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Issue Dt:
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12/26/2000
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Application #:
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09311081
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Filing Dt:
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05/13/1999
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Title:
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PACKAGE FOR ELECTRONIC DEVICES
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Patent #:
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Issue Dt:
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09/02/2003
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Application #:
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09745966
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Filing Dt:
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12/22/2000
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Title:
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MODULE WITH BUMPS FOR CONNECTION AND SUPPORT
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Assignee
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| 3285 VETERAN'S MEMORIAL HWY |
| SUITE A-7, A-10 |
| RONKONKOMA, NEW YORK 11779 |
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Correspondence name and address
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HANNAH TRAN
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3301 W MARSHALL AVENUE
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SUITE 302
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LONGVIEW, TX 75604
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