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Patent Assignment Details
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Reel/Frame:021578/0578   Pages: 3
Recorded: 09/18/2008
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
12225293
Filing Dt:
09/18/2008
Publication #:
Pub Dt:
09/16/2010
Title:
Joint Structure Between a Wound Coil and An IC-Chip for a Noncontact RFID Device and Methods of Manufacturing The Same
Assignor
1
Exec Dt:
09/01/2008
Assignee
1
1-28-10, OHNUMACHO
HITACHI-SHI, IBARAKI, JAPAN
Correspondence name and address
WENDEROTH, LIND & PONACK, L.L.P.
ATTN: W. DOUGLAS HAHM, ESQ.
2033 K STREET, N.W., SUITE 800
WASHINGTON, DC 20006-1021

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