Patent Assignment Details
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| Reel/Frame: | 063584/0578 | |
| Pages: | 8 |
| | Recorded: | 05/09/2023 | | |
| Attorney Dkt #: | 62864US03 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/13/2023
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Application #:
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17028621
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Filing Dt:
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09/22/2020
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Publication #:
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Pub Dt:
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01/21/2021
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Title:
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SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
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Assignee
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| 100, AMKOR-RO |
| BUK-GU, GWANGJU, KOREA, REPUBLIC OF 61006 |
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Correspondence name and address
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MCANDREWS, HELD & MALLOY, LTD.
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500 WEST MADISON STREET
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SUITE 3400
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CHICAGO, IL 60661
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