Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Reel/Frame: | 026698/0579 | |
| Pages: | 3 |
| | Recorded: | 08/04/2011 | | |
Attorney Dkt #: | AMIT 1047/901 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
Total properties:
3
|
|
Patent #:
|
|
Issue Dt:
|
12/22/2009
|
Application #:
|
11250421
|
Filing Dt:
|
10/17/2005
|
Publication #:
|
|
Pub Dt:
|
04/12/2007
| | | | |
Title:
|
NOVEL INTEGRATED CIRCUIT SUPPORT STRUCTURES AND THEIR FABRICATION
|
|
|
Patent #:
|
|
Issue Dt:
|
03/23/2010
|
Application #:
|
11421600
|
Filing Dt:
|
06/01/2006
|
Publication #:
|
|
Pub Dt:
|
12/06/2007
| | | | |
Title:
|
ADVANCED MULTILAYER CORELESS SUPPORT STRUCTURES AND METHOD FOR THEIR FABRICATION
|
|
|
Patent #:
|
|
Issue Dt:
|
03/02/2010
|
Application #:
|
11737269
|
Filing Dt:
|
04/19/2007
|
Publication #:
|
|
Pub Dt:
|
12/20/2007
| | | | |
Title:
|
CORELESS CAVITY SUBSTRATES FOR CHIP PACKAGING AND THEIR FABRICATION
|
|
Assignee
|
|
|
FOUNDERPCB INDUSTRY PARK, FUSHAN INDUSTRY ZONE, QIANWU, DOUMEN |
ZHUHAI, CHINA 519173 |
|
Correspondence name and address
|
|
JMB, FACTOR & CO.
|
|
1 HARMARPE STREET, HAR HOTZVIM
|
|
JERUSALEM, 91450 ISRAEL
|
Search Results as of:
06/04/2024 09:41 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|