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Reel/Frame:018745/0580   Pages: 3
Recorded: 12/29/2006
Attorney Dkt #:cu-5412 wwp
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/06/2009
Application #:
11647703
Filing Dt:
12/29/2006
Publication #:
Pub Dt:
09/27/2007
Title:
STACK PACKAGE UTILIZING THROUGH VIAS AND RE-DISTRIBUTION LINES
Assignors
1
Exec Dt:
12/20/2006
2
Exec Dt:
12/20/2006
Assignee
1
SAN 136-1, AMI-RI
BUBAL-EUB, ICHEON-SI
KYOUNGKI-DO, KOREA, REPUBLIC OF
Correspondence name and address
RICHARD J. STREIT
C/O LADAS & PARRY
224 SOUTH MICHIGAN AVENUE
CHICAGO, IL 60604

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