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Reel/Frame:062160/0582   Pages: 8
Recorded: 12/20/2022
Attorney Dkt #:1012-3457/2019P51004 US01
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
18085072
Filing Dt:
12/20/2022
Publication #:
Pub Dt:
04/27/2023
Title:
SEMICONDUCTOR DEVICE HAVING A SOLDERED JOINT WITH ONE OR MORE INTERMETALLIC PHASES
Assignors
1
Exec Dt:
01/22/2020
2
Exec Dt:
01/20/2020
3
Exec Dt:
11/11/2019
4
Exec Dt:
11/15/2019
Assignee
1
SIEMENSSTRASSE 2
VILLACH, AUSTRIA 9500
Correspondence name and address
MURPHY, BILAK & HOMILLER, PLLC
PO BOX 1959
CARY, NC 27572-1959

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