Patent Assignment Details
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| Reel/Frame: | 034161/0583 | |
| Pages: | 7 |
| | Recorded: | 11/05/2014 | | |
| Attorney Dkt #: | RC-14-003US |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE OF ASSIGNEE PREVIOUSLY RECORDED AT REEL: 033997 FRAME: 0921. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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14520354
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Filing Dt:
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10/22/2014
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Publication #:
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Pub Dt:
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01/07/2016
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Title:
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INTEGRATED CIRCUIT ASSEMBLY AND INTEGRATED CIRCUIT PACKAGING STRUCTURE
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Assignee
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| 14F, NO.8, TAI YUEN 1ST STREET, CHUPEI CITY, |
| HSINCHU, TAIWAN 302 |
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Correspondence name and address
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HDLS IPR SERVICES
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P.O. BOX 230970
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CENTREVILLE, VA 20120
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