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Patent Assignment Details
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Reel/Frame:015736/0585   Pages: 12
Recorded: 08/26/2004
Conveyance: SECURITY AGREEMENT
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
10762666
Filing Dt:
01/22/2004
Publication #:
Pub Dt:
08/05/2004
Title:
Method and apparatus for the use of self-assembled nanowires for the removal of heat from integrated circuits
Assignor
1
Exec Dt:
08/19/2004
Assignees
1
350 MARINE PARKWAY, SUITE 300
REDWOOD SHORES, CALIFORNIA 94065
2
41 MADISON AVENUE, 25TH FLOOR
NEW YORK, NEW YORK 10010
3
41 MADISON AVENUE, 25TH FLOOR
NEW YORK, NEW YORK 10010
4
41 MADISON AVENUE, 25TH FLOOR
NEW YORK, NEW YORK 10010
5
41 MADISON AVENUE, 25TH FLOOR
NEW YORK, NEW YORK 10010
Correspondence name and address
GUNDERSON DETTMER STOUGH ET AL
MEGAN M. PIETROPAOLO, ESQ.
610 LINCOLN STREET
WALTHAM, MA 02451

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