Patent Assignment Details
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| Reel/Frame: | 053926/0590 | |
| Pages: | 2 |
| | Recorded: | 09/30/2020 | | |
| Attorney Dkt #: | GBSZZT003 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/09/2024
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Application #:
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17043736
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Filing Dt:
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09/30/2020
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Publication #:
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Pub Dt:
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02/04/2021
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Title:
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RESIN SPACER FOR CHIP STACKING AND PACKAGING AND PREPARATION METHOD THEREOF
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Assignee
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| NO.15 ZHONGHONG ROAD, HUQIU DISTRICT, JIANGSU |
| SUZHOU, CHINA 215100 |
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Correspondence name and address
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GOKALP BAYRAMOGLU
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1540 WEST WARM SPRINGS RD., SUITE 100
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HENDERSON, NV 89014
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05/28/2024 12:39 PM
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