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Reel/Frame:	039822/0591			Pages:	13
		Recorded:	07/08/2016
Attorney Dkt #:	UTACS2015SVE103
Conveyance:	CORRECTIVE ASSIGNMENT TO CORRECT THE ADD ANNEX INADVERTENTLY LEFT OUT ORIGINAL ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED AT REEL: 037880 FRAME: 0534. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.

Total properties: 69

Patent #:	6326678	Issue Dt:	12/04/2001	Application #:	08116305	Filing Dt:	09/03/1993
Title:	MOLDED PLASTIC PACKAGE WITH HEAT SINK AND ENHANCED ELECTRICAL PERFORMANCE

Patent #:	5843808	Issue Dt:	12/01/1998	Application #:	08585134	Filing Dt:	01/11/1996
Title:	STRUCTURE AND METHOD FOR AUTOMATED ASSEMBLY OF A TAB GRID ARRAY PACKAGE

Patent #:	6111324	Issue Dt:	08/29/2000	Application #:	09020903	Filing Dt:	02/05/1998
Title:	INTEGRATED CARRIER RING/STIFFENER AND METHOD FOR MANUFACTURING A FLEXIBLE INTEGRATED CIRCUIT PACKAGE

Patent #:	6285075	Issue Dt:	09/04/2001	Application #:	09184787	Filing Dt:	11/02/1998
Title:	INTEGRATED CIRCUIT PACKAGE WITH BONDING PLANES ON A CERAMIC RING USING AN ADHESIVE ASSEMBLY

Patent #:	6284569	Issue Dt:	09/04/2001	Application #:	09309248	Filing Dt:	05/10/1999
Title:	INTEGRATED CARRIER RING/STIFFENER AND METHOD FOR MANUFACTURING A FLEXIBLE INTEGRATED CIRCUIT PACKAGE

Patent #:	6429048	Issue Dt:	08/06/2002	Application #:	09730440	Filing Dt:	12/05/2000
Publication #:	US20020068378	Pub Dt:	06/06/2002
Title:	METAL FOIL LAMINATED IC PACKAGE

Patent #:	6933594	Issue Dt:	08/23/2005	Application #:	09802678	Filing Dt:	03/09/2001
Publication #:	US20010008305	Pub Dt:	07/19/2001
Title:	LEADLESS PLASTIC CHIP CARRIER WITH ETCH BACK PAD SINGULATION

Patent #:	6635957	Issue Dt:	10/21/2003	Application #:	09802679	Filing Dt:	03/09/2001
Publication #:	US20010014538	Pub Dt:	08/16/2001
Title:	LEADLESS PLASTIC CHIP CARRIER WITH ETCH BACK PAD SINGULATION AND DIE ATTACH PAD ARRAY

Patent #:	6734552	Issue Dt:	05/11/2004	Application #:	09902878	Filing Dt:	07/11/2001
Publication #:	US20030011064	Pub Dt:	01/16/2003
Title:	ENHANCED THERMAL DISSIPATION INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING ENHANCED THERMAL DISSIPATION INTEGRATED CIRCUIT PACKAGE

Patent #:	6790710	Issue Dt:	09/14/2004	Application #:	10062650	Filing Dt:	01/31/2002
Publication #:	US20030143781	Pub Dt:	07/31/2003
Title:	METHOD OF MANUFACTURING AN INTEGRATED CIRCUIT PACKAGE

Patent #:	6734044	Issue Dt:	05/11/2004	Application #:	10166458	Filing Dt:	06/10/2002
Title:	MULTIPLE LEADFRAME LAMINATED IC PACKAGE

Patent #:	6940154	Issue Dt:	09/06/2005	Application #:	10178372	Filing Dt:	06/24/2002
Publication #:	US20030234454	Pub Dt:	12/25/2003
Title:	INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING THE INTEGRATED CIRCUIT PACKAGE

Patent #:	6800948	Issue Dt:	10/05/2004	Application #:	10197832	Filing Dt:	07/19/2002
Title:	BALL GRID ARRAY PACKAGE

Patent #:	6667191	Issue Dt:	12/23/2003	Application #:	10211567	Filing Dt:	08/05/2002
Title:	CHIP SCALE INTEGRATED CIRCUIT PACKAGE

Patent #:	6821817	Issue Dt:	11/23/2004	Application #:	10232678	Filing Dt:	09/03/2002
Title:	PREMOLDED CAVITY IC PACKAGE

Patent #:	6818978	Issue Dt:	11/16/2004	Application #:	10299622	Filing Dt:	11/19/2002
Title:	BALL GRID ARRAY PACKAGE WITH SHIELDING

Patent #:	6781242	Issue Dt:	08/24/2004	Application #:	10307279	Filing Dt:	12/02/2002
Title:	THIN BALL GRID ARRAY PACKAGE

Patent #:	6872661	Issue Dt:	03/29/2005	Application #:	10318262	Filing Dt:	12/13/2002
Title:	LEADLESS PLASTIC CHIP CARRIER WITH ETCH BACK PAD SINGULATION AND DIE ATTACH PAD ARRAY

Patent #:	6737755	Issue Dt:	05/18/2004	Application #:	10322661	Filing Dt:	12/19/2002
Title:	BALL GRID ARRAY PACKAGE WITH IMPROVED THERMAL CHARACTERISTICS

Patent #:	6979594	Issue Dt:	12/27/2005	Application #:	10323657	Filing Dt:	12/20/2002
Title:	PROCESS FOR MANUFACTURING BALL GRID ARRAY PACKAGE

Patent #:	7071545	Issue Dt:	07/04/2006	Application #:	10323658	Filing Dt:	12/20/2002
Title:	SHIELDED INTEGRATED CIRCUIT PACKAGE

Patent #:	6989294	Issue Dt:	01/24/2006	Application #:	10353241	Filing Dt:	01/28/2003
Title:	LEADLESS PLASTIC CHIP CARRIER WITH ETCH BACK PAD SINGULATION

Patent #:	6818472	Issue Dt:	11/16/2004	Application #:	10372421	Filing Dt:	02/24/2003
Title:	BALL GRID ARRAY PACKAGE

Patent #:	6818980	Issue Dt:	11/16/2004	Application #:	10430331	Filing Dt:	05/07/2003
Title:	STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Patent #:	6987032	Issue Dt:	01/17/2006	Application #:	10643961	Filing Dt:	08/20/2003
Title:	BALL GRID ARRAY PACKAGE AND PROCESS FOR MANUFACTURING SAME

Patent #:	6933176	Issue Dt:	08/23/2005	Application #:	10647696	Filing Dt:	08/25/2003
Title:	BALL GRID ARRAY PACKAGE AND PROCESS FOR MANUFACTURING SAME

Patent #:	7372151	Issue Dt:	05/13/2008	Application #:	10660611	Filing Dt:	09/12/2003
Title:	BALL GRID ARRAY PACKAGE AND PROCESS FOR MANUFACTURING SAME

Patent #:	7033517	Issue Dt:	04/25/2006	Application #:	10661480	Filing Dt:	09/15/2003
Title:	METHOD OF FABRICATING A LEADLESS PLASTIC CHIP CARRIER

Patent #:	7439099	Issue Dt:	10/21/2008	Application #:	10678417	Filing Dt:	10/03/2003
Title:	THIN BALL GRID ARRAY PACKAGE

Patent #:	7224048	Issue Dt:	05/29/2007	Application #:	10678419	Filing Dt:	10/03/2003
Title:	FLIP CHIP BALL GRID ARRAY PACKAGE

Patent #:	7449771	Issue Dt:	11/11/2008	Application #:	10681983	Filing Dt:	10/09/2003
Title:	MULTIPLE LEADFRAME LAMINATED IC PACKAGE

Patent #:	6984785	Issue Dt:	01/10/2006	Application #:	10694511	Filing Dt:	10/27/2003
Title:	THERMALLY ENHANCED CAVITY-DOWN INTEGRATED CIRCUIT PACKAGE

Patent #:	6946324	Issue Dt:	09/20/2005	Application #:	10697339	Filing Dt:	10/30/2003
Title:	PROCESS FOR FABRICATING A LEADLESS PLASTIC CHIP CARRIER

Patent #:	6964918	Issue Dt:	11/15/2005	Application #:	10757499	Filing Dt:	01/15/2004
Title:	ELECTRONIC COMPONENTS SUCH AS THIN ARRAY PLASTIC PACKAGES AND PROCESS FOR FABRICATING SAME

Patent #:	7009286	Issue Dt:	03/07/2006	Application #:	10757508	Filing Dt:	01/15/2004
Title:	THIN LEADLESS PLASTIC CHIP CARRIER

Patent #:	6982491	Issue Dt:	01/03/2006	Application #:	10759247	Filing Dt:	01/20/2004
Title:	SENSOR SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Patent #:	7049177	Issue Dt:	05/23/2006	Application #:	10765192	Filing Dt:	01/28/2004
Title:	LEADLESS PLASTIC CHIP CARRIER WITH STANDOFF CONTACTS AND DIE ATTACH PAD

Patent #:	6841859	Issue Dt:	01/11/2005	Application #:	10800973	Filing Dt:	03/16/2004
Title:	PREMOLDED CAVITY IC PACKAGE

Patent #:	7015072	Issue Dt:	03/21/2006	Application #:	10803782	Filing Dt:	03/18/2004
Publication #:	US20050003585	Pub Dt:	01/06/2005
Title:	METHOD OF MANUFACTURING AN ENHANCED THERMAL DISSIPATION INTEGRATED CIRCUIT PACKAGE

Patent #:	7091581	Issue Dt:	08/15/2006	Application #:	10865760	Filing Dt:	06/14/2004
Title:	INTEGRATED CIRCUIT PACKAGE AND PROCESS FOR FABRICATING THE SAME

Patent #:	7315080	Issue Dt:	01/01/2008	Application #:	10885965	Filing Dt:	07/08/2004
Title:	BALL GRID ARRAY PACKAGE THAT INCLUDES A COLLAPSIBLE SPACER FOR SEPARATING DIE ADAPTER FROM A HEAT SPREADER

Patent #:	7381588	Issue Dt:	06/03/2008	Application #:	10885966	Filing Dt:	07/08/2004
Title:	SHIELDED INTEGRATED CIRCUIT PACKAGE

Patent #:	7411289	Issue Dt:	08/12/2008	Application #:	10891709	Filing Dt:	07/15/2004
Title:	INTEGRATED CIRCUIT PACKAGE WITH PARTIALLY EXPOSED CONTACT PADS AND PROCESS FOR FABRICATING THE SAME

Patent #:	7595225	Issue Dt:	09/29/2009	Application #:	10957576	Filing Dt:	10/05/2004
Title:	LEADLESS PLASTIC CHIP CARRIER WITH CONTACT STANDOFF

Patent #:	7732914	Issue Dt:	06/08/2010	Application #:	10985233	Filing Dt:	11/10/2004
Title:	CAVITY-TYPE INTEGRATED CIRCUIT PACKAGE

Patent #:	7371610	Issue Dt:	05/13/2008	Application #:	10990008	Filing Dt:	11/16/2004
Title:	PROCESS FOR FABRICATING AN INTEGRATED CIRCUIT PACKAGE WITH REDUCED MOLD WARPING

Patent #:	8330270	Issue Dt:	12/11/2012	Application #:	11008593	Filing Dt:	12/09/2004
Title:	INTEGRATED CIRCUIT PACKAGE HAVING A PLURALITY OF SPACED APART PAD PORTIONS

Patent #:	7270867	Issue Dt:	09/18/2007	Application #:	11022130	Filing Dt:	12/22/2004
Title:	LEADLESS PLASTIC CHIP CARRIER

Patent #:	7358119	Issue Dt:	04/15/2008	Application #:	11033928	Filing Dt:	01/12/2005
Publication #:	US20060154403	Pub Dt:	07/13/2006
Title:	THIN ARRAY PLASTIC PACKAGE WITHOUT DIE ATTACH PAD AND PROCESS FOR FABRICATING THE SAME

Patent #:	8610262	Issue Dt:	12/17/2013	Application #:	11061895	Filing Dt:	02/18/2005
Title:	BALL GRID ARRAY PACKAGE WITH IMPROVED THERMAL CHARACTERISTICS

Patent #:	7482690	Issue Dt:	01/27/2009	Application #:	11071737	Filing Dt:	03/03/2005
Title:	ELECTRONIC COMPONENTS SUCH AS THIN ARRAY PLASTIC PACKAGES AND PROCESS FOR FABRICATING SAME

Patent #:	6995460	Issue Dt:	02/07/2006	Application #:	11123489	Filing Dt:	05/06/2005
Title:	LEADLESS PLASTIC CHIP CARRIER WITH ETCH BACK PAD SINGULATION

Patent #:	7271032	Issue Dt:	09/18/2007	Application #:	11123491	Filing Dt:	05/06/2005
Title:	LEADLESS PLASTIC CHIP CARRIER WITH ETCH BACK PAD SINGULATION

Patent #:	7247526	Issue Dt:	07/24/2007	Application #:	11137973	Filing Dt:	05/25/2005
Title:	PROCESS FOR FABRICATING AN INTEGRATED CIRCUIT PACKAGE

Patent #:	7081403	Issue Dt:	07/25/2006	Application #:	11151469	Filing Dt:	06/13/2005
Title:	THIN LEADLESS PLASTIC CHIP CARRIER

Patent #:	7226811	Issue Dt:	06/05/2007	Application #:	11175663	Filing Dt:	07/06/2005
Title:	PROCESS FOR FABRICATING A LEADLESS PLASTIC CHIP CARRIER

Patent #:	7348663	Issue Dt:	03/25/2008	Application #:	11183290	Filing Dt:	07/15/2005
Title:	INTEGRATED CIRCUIT PACKAGE AND METHOD FOR FABRICATING SAME

Patent #:	7342305	Issue Dt:	03/11/2008	Application #:	11191678	Filing Dt:	07/28/2005
Title:	THERMALLY ENHANCED CAVITY-DOWN INTEGRATED CIRCUIT PACKAGE

Patent #:	7232755	Issue Dt:	06/19/2007	Application #:	11194993	Filing Dt:	08/02/2005
Title:	PROCESS FOR FABRICATING PAD FRAME AND INTEGRATED CIRCUIT PACKAGE

Patent #:	7410830	Issue Dt:	08/12/2008	Application #:	11234963	Filing Dt:	09/26/2005
Title:	LEADLESS PLASTIC CHIP CARRIER AND METHOD OF FABRICATING SAME

Patent #:	7344920	Issue Dt:	03/18/2008	Application #:	11798417	Filing Dt:	05/14/2007
Title:	INTEGRATED CIRCUIT PACKAGE AND METHOD FOR FABRICATING SAME

Patent #:	9806006	Issue Dt:	10/31/2017	Application #:	11916242	Filing Dt:	10/07/2010
Publication #:	US20110284495	Pub Dt:	11/24/2011
Title:	ETCH ISOLATION LPCC/QFN STRIP

Patent #:	7858443	Issue Dt:	12/28/2010	Application #:	12400391	Filing Dt:	03/09/2009
Publication #:	US20100224970	Pub Dt:	09/09/2010
Title:	LEADLESS INTEGRATED CIRCUIT PACKAGE HAVING STANDOFF CONTACTS AND DIE ATTACH PAD

Patent #:	8736037	Issue Dt:	05/27/2014	Application #:	12775711	Filing Dt:	05/07/2010
Publication #:	US20100224972	Pub Dt:	09/09/2010
Title:	LEADLESS INTEGRATED CIRCUIT PACKAGE HAVING STANDOFF CONTACTS AND DIE ATTACH PAD

Patent #:	8486762	Issue Dt:	07/16/2013	Application #:	13254905	Filing Dt:	11/04/2011
Publication #:	US20120052631	Pub Dt:	03/01/2012
Title:	LEADLESS ARRAY PLASTIC PACKAGE WITH VARIOUS IC PACKAGING CONFIGURATIONS

Patent #:	9520306	Issue Dt:	12/13/2016	Application #:	13618509	Filing Dt:	09/14/2012
Publication #:	US20160013075	Pub Dt:	01/14/2016
Title:	METHOD OF FABRICATING AN INTEGRATED CIRCUIT (IC) PACKAGE HAVING A PLURALITY OF SPACED APART PAD PORTIONS

Patent #:	8828801	Issue Dt:	09/09/2014	Application #:	13916391	Filing Dt:	06/12/2013
Publication #:	US20130273692	Pub Dt:	10/17/2013
Title:	LEADLESS ARRAY PLASTIC PACKAGE WITH VARIOUS IC PACKAGING CONFIGURATIONS

Patent #:	9449903	Issue Dt:	09/20/2016	Application #:	14108430	Filing Dt:	12/17/2013
Publication #:	US20140183712	Pub Dt:	07/03/2014
Title:	BALL GRID ARRAY PACKAGE WITH IMPROVED THERMAL CHARACTERISTICS

Patent #:	9305889	Issue Dt:	04/05/2016	Application #:	14287603	Filing Dt:	05/27/2014
Publication #:	US20140367865	Pub Dt:	12/18/2014
Title:	LEADLESS INTEGRATED CIRCUIT PACKAGE HAVING STANDOFF CONTACTS AND DIE ATTACH PAD

Assignor

UTAC HONG KONG LIMITED

Exec Dt:

05/08/2015

Assignee

UTAC HEADQUARTERS PTE. LTD.

22 ANG MO KIO INDUSTRIAL PARK 2

SINGAPORE, SINGAPORE 569506

Correspondence name and address
	HORIZON IP PTE. LTD.
	7500A BEACH ROAD, #04-306/308
	THE PLAZA
	SINGAPORE, 199591 SINGAPORE

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