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Reel/Frame:048210/0591   Pages: 6
Recorded: 01/31/2019
Attorney Dkt #:08036ZP USA
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
08/02/2022
Application #:
16101869
Filing Dt:
08/13/2018
Publication #:
Pub Dt:
02/21/2019
Title:
CHEMICAL MECHANICAL PLANARIZATION (CMP) COMPOSITION AND METHODS THEREFORE FOR COPPER AND THROUGH SILICA VIA (TSV) APPLICATIONS
Assignors
1
Exec Dt:
09/28/2018
2
Exec Dt:
09/28/2018
3
Exec Dt:
09/28/2018
4
Exec Dt:
10/01/2018
5
Exec Dt:
10/01/2018
6
Exec Dt:
10/01/2018
7
Exec Dt:
09/28/2018
8
Exec Dt:
01/25/2019
9
Exec Dt:
09/28/2018
10
Exec Dt:
09/28/2018
Assignee
1
8555 SOUTH RIVER PARKWAY
PATENT DEPT.
TEMPE, ARIZONA 85284
Correspondence name and address
LISA HOFFMANN
7350 TILGHMAN STREET, SUITE 104
PATENT DEPT.
ALLENTOWN, PA 18106-9000

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