Patent Assignment Details
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| Reel/Frame: | 064158/0591 | |
| Pages: | 5 |
| | Recorded: | 07/05/2023 | | |
| Attorney Dkt #: | 135676-US-PA-PCT |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18270840
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Filing Dt:
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07/04/2023
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Publication #:
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Pub Dt:
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02/29/2024
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Title:
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PACKAGE STRUCTURE FOR REDUCING WARPAGE OF PLASTIC PACKAGE WAFER AND METHOD FOR MANUFACTURING THE SAME
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Assignees
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| BUILDING D1, CHINA SENSOR NETWORK INTERNATIONAL INNOVATION PARK, 200 LINGHU BOULEVARD WUXI, |
| JIANGSU, CHINA 214000 |
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| 778 CHUANGXIN WEST ROAD, PILOT FREE TRADE ZONE, PUDONGXIN DISTRICT |
| SHANGHAI, CHINA 200127 |
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Correspondence name and address
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JCIPRNET
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8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
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TAIPEI, 100404 TAIWAN
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06/13/2024 03:25 PM
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