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Total properties:
16
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Patent #:
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Issue Dt:
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09/30/1997
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Application #:
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08550262
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Filing Dt:
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10/30/1995
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Title:
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FLIP-CHIP MOUNTING ASSEMBLY AND METHOD WITH VERTICAL WAFER FEEDER
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Patent #:
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Issue Dt:
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06/23/1998
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Application #:
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08798457
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Filing Dt:
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02/10/1997
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Title:
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FLIP CHIP-ON-FLIP CHIP MULTI-CHIP MODULE
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Patent #:
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Issue Dt:
|
04/06/1999
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Application #:
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08883694
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Filing Dt:
|
06/27/1997
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Title:
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PROCESS FOR CONVERTING A WIRE BOND PAD TO A FLIP CHIP SOLDER BUMP PAD AND PAD FORMED THEREBY
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Patent #:
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Issue Dt:
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06/22/1999
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Application #:
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09008457
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Filing Dt:
|
01/16/1998
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Title:
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FLIP CHIP-ON-FLIP CHIP MULTI-CHIP MODULE
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Patent #:
|
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Issue Dt:
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09/21/1999
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Application #:
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09032148
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Filing Dt:
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02/27/1998
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Title:
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PROCESS FOR PRODUCING FLIP CHIP CIRCUIT BOARD ASSEMBLY EXHIBITING ENHANCED RELIABILITY
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Patent #:
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Issue Dt:
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12/05/2000
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Application #:
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09090495
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Filing Dt:
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06/04/1998
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Title:
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FLIP CHIP ON CIRCUIT BOARD WITH ENHANCED HEAT DISSIPATION AND METHOD THEREFOR
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Patent #:
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Issue Dt:
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01/30/2001
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Application #:
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09216769
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Filing Dt:
|
12/21/1998
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Title:
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FLIP CHIP SOLDER BUMP PAD
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|
|
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Patent #:
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|
Issue Dt:
|
07/17/2001
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Application #:
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09434552
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Filing Dt:
|
11/08/1999
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Title:
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FLIP CHIP WITH BACKSIDE ELECTRICAL CONTACT AND ASSEMBLY AND METHOD THEREFOR
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|
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Patent #:
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|
Issue Dt:
|
06/11/2002
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Application #:
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09435843
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Filing Dt:
|
11/08/1999
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Title:
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METHOD FOR FORMING SOLDER BUMPS USING A SOLDER JETTING DEVICE
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Patent #:
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Issue Dt:
|
05/27/2003
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Application #:
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10075979
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Filing Dt:
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02/15/2002
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Title:
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SOLDER PROCESS AND SOLDER ALLOY THEREFOR
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|
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Patent #:
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|
Issue Dt:
|
09/16/2003
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Application #:
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10379753
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Filing Dt:
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03/05/2003
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Publication #:
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Pub Dt:
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08/21/2003
| | | | |
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Title:
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SOLDER PROCESS AND SOLDER ALLOY THEREFOR
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Patent #:
|
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Issue Dt:
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11/23/2004
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Application #:
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10461318
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Filing Dt:
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06/13/2003
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Publication #:
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Pub Dt:
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12/16/2004
| | | | |
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Title:
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FLIP-CHIP INTERCONNECT WITH INCREASED CURRENT-CARRYING CAPABILITY
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Patent #:
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Issue Dt:
|
11/23/2004
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Application #:
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10461577
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Filing Dt:
|
06/13/2003
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Title:
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RELAXED TOLERANCE FLIP CHIP ASSEMBLY
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|
|
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Patent #:
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|
Issue Dt:
|
05/02/2006
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Application #:
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10908162
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Filing Dt:
|
04/29/2005
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Title:
|
METHOD OF ATTACHING A FLIP CHIP DEVICE AND CIRCUIT ASSEMBLY FORMED THEREBY
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|
|
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Patent #:
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|
Issue Dt:
|
02/14/2006
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Application #:
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10955706
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Filing Dt:
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09/30/2004
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Publication #:
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Pub Dt:
|
02/24/2005
| | | | |
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Title:
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RELAXED TOLERANCE FLIP CHIP ASSEMBLY
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|
|
|
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Patent #:
|
|
Issue Dt:
|
03/31/2009
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Application #:
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11190130
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Filing Dt:
|
07/26/2005
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Publication #:
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Pub Dt:
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02/01/2007
| | | | |
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Title:
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METHOD OF MAKING AN ELECTRONIC ASSEMBLY
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|
