Patent Assignment Details
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| Reel/Frame: | 048507/0592 | |
| Pages: | 3 |
| | Recorded: | 03/05/2019 | | |
| Attorney Dkt #: | TSMP20180782US00 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/15/2020
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Application #:
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16265431
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Filing Dt:
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02/01/2019
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Publication #:
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Pub Dt:
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01/02/2020
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Title:
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OHMIC CONTACT STRUCTURE, SEMICONDUCTOR DEVICE INCLUDING AN OHMIC CONTACT STRUCTURE, AND METHOD FOR FORMING THE SAME
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Assignees
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| NO. 1, SEC. 4, ROOSEVELT ROAD |
| ZHONGZHENG DIST. |
| TAIPEI CITY, TAIWAN 100 |
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Correspondence name and address
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SLATER MATSIL, LLP
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17950 PRESTON RD., SUITE 1000
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DALLAS, TX 75252
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