Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 060250/0593 | |
| Pages: | 5 |
| | Recorded: | 06/20/2022 | | |
| Attorney Dkt #: | 37399-00353 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17787424
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Filing Dt:
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06/20/2022
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Publication #:
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Pub Dt:
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02/09/2023
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Title:
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THERMOSETTING EPOXY RESIN COMPOSITION AND PREPREG, LAMINATED BOARD AND PRINTED CIRCUIT BOARD USING THERMOSETTING EPOXY RESIN COMPOSITION
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Assignee
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| NO.5 WESTERN INDUSTRY ROAD, SONGSHAN LAKE NATIONAL HIGH-TECH |
| INDUSTRIAL DEVELOPMENT ZONE DONGGUAN |
| GUANGDONG, CHINA 523808 |
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Correspondence name and address
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MCDONALD HOPKINS LLC
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600 SUPERIOR AVENUE, EAST
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SUITE 2100
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CLEVELAND, 44114-2653 UNITED STATES
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06/06/2024 03:04 PM
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