Patent Assignment Details
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| Reel/Frame: | 010533/0596 | |
| Pages: | 2 |
| | Recorded: | 01/28/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/29/2002
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Application #:
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09492820
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Filing Dt:
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01/28/2000
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Title:
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Low-Pin-Count Chip Package And Manufacturing Method Thereof
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Assignee
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| NO. 26, CHIN 3RD. ROAD |
| NANTZE EXPORT PROCESSING ZONE, TAIWAN R.O.C |
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Correspondence name and address
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LOWE HAUPTMAN GOPSTEIN GILMAN ET AL
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BENJAMIN J. HAUPTMAN
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1700 DIAGONAL ROAD, SUITE 310
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ALEXANDRIA, VIRGINIA 22314
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