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Patent Assignment Details
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Reel/Frame:044403/0596   Pages: 7
Recorded: 12/15/2017
Attorney Dkt #:UTACS2015SVE103
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 2
1
Patent #:
Issue Dt:
04/17/2007
Application #:
10893087
Filing Dt:
07/16/2004
Title:
PROCESS OF FABRICATING SEMICONDUCTOR PACKAGES USING LEADFRAMES ROUGHENED WITH CHEMICAL ETCHANT
2
Patent #:
Issue Dt:
02/05/2008
Application #:
11292769
Filing Dt:
12/02/2005
Publication #:
Pub Dt:
05/11/2006
Title:
SEMICONDUCTOR PACKAGE INCLUDING LEADFRAME ROUGHENED WITH CHEMICAL ETCHANT TO PREVENT SEPARATION BETWEEN LEADFRAME AND MOLDING COMPOUND
Assignor
1
Exec Dt:
05/08/2015
Assignee
1
22 ANG MO KIO INDUSTRIAL PARK 2
SINGAPORE, SINGAPORE 569506
Correspondence name and address
HORIZON IP PTE. LTD.
7500A BEACH ROAD, #04-306/308
THE PLAZA
SINGAPORE, 199591 SINGAPORE

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