Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 030329/0598 | |
| Pages: | 4 |
| | Recorded: | 05/01/2013 | | |
| Attorney Dkt #: | 093047C1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
04/04/2017
|
Application #:
|
13874983
|
Filing Dt:
|
05/01/2013
|
|
Publication #:
|
|
Pub Dt:
|
09/19/2013
| | | | |
|
Title:
|
INTEGRATED CIRCUIT CHIP USING TOP POST-PASSIVATION TECHNOLOGY AND BOTTOM STRUCTURE TECHNOLOGY
|
|
|
Assignee
|
|
|
|
|
| 8F.-1, NO. 29, PUDING ROAD |
| EAST DISTRICT |
| HSIN-CHU, TAIWAN 30072 |
|
|
Correspondence name and address
|
| |
QUALCOMM INCORPORATED/SEYFARTH SHAW LLP
|
| |
2029 CENTURY PARK EAST, SUITE 3500
|
| |
LOS ANGELES, CA 90067-3021
|
Search Results as of:
05/31/2024 12:25 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
