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Patent Assignment Details
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Reel/Frame:007374/0602   Pages: 3
Recorded: 03/13/1995
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/05/1996
Application #:
08383511
Filing Dt:
02/06/1995
Title:
INTEGRATED CIRCUIT PACKAGES WITH HEAT DISSIPATION FOR HIGH CURRENT LOAD
Assignor
1
Exec Dt:
02/13/1995
Assignee
1
7750 EDGEWATER DRIVE OAKLAND, CA 94621
OAKLAND,, CALIFORNIA
Correspondence name and address
TOWNSEND AND TOWNSEND KHOURIE AND CREW
M. HENRY HEINES
20TH FLOOR, STEUART STREET TOWER
ONE MARKET PLAZA
SAN FRANCISCO, CA 94105-1492

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