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Reel/Frame:061586/0602   Pages: 7
Recorded: 10/29/2022
Attorney Dkt #:04017.0293U2 (A 5838 US)
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
17652580
Filing Dt:
02/25/2022
Publication #:
Pub Dt:
08/11/2022
Title:
Semi-Flex Component Carrier With Dielectric Material Surrounding an Embedded Component and Having Locally Reduced Young Modulus
Assignors
1
Exec Dt:
01/14/2021
2
Exec Dt:
01/14/2021
3
Exec Dt:
01/14/2021
Assignee
1
NO. 5000 JIN DU ROAD
SHANGHAI, CHINA 201108
Correspondence name and address
SMITH TEMPEL BLAHA LLC DOCKETING DEPARTM
1600 PARKWOOD CIRCLE, SUITE 620
ATLANTA, GA 30339

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