Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 050870/0604 | |
| Pages: | 7 |
| | Recorded: | 03/27/2019 | | |
| Attorney Dkt #: | TI-79754 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE RE-FILING ASSIGNMENT TO ENSURE PROPER "USPTO@TI.COM" EMAIL ADDRESS IS REFLECTED IN ASSIGNMENT FILING. PREVIOUSLY RECORDED ON REEL 048652 FRAME 0590. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/23/2021
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Application #:
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16359628
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Filing Dt:
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03/20/2019
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Publication #:
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Pub Dt:
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09/24/2020
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Title:
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MULTI-CHIP PACKAGE WITH HIGH THERMAL CONDUCTIVITY DIE ATTACH
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Assignee
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| 12500 TI BOULEVARD, M/S 3999 |
| DALLAS, TEXAS 75243 |
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Correspondence name and address
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TEXAS INSTRUMENTS INCORPORATED
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PO BOX 655474
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M/S 3999
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DALLAS, TX 75265
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