Patent Assignment Details
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| Reel/Frame: | 009424/0605 | |
| Pages: | 8 |
| | Recorded: | 08/21/1998 | | |
| Conveyance: | MERGER AND CHANGE OF NAME |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/14/1999
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Application #:
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08915077
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Filing Dt:
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08/20/1997
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Title:
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BALL GRID ARRAY SEMICONDUCTOR PACKAGE WITH SOLDER BALLS FUSED ON PRINTED CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
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Assignee
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| 280-8, 2GA, SUNGSU-DONG, SUNGDONG-KU |
| SEOUL, KOREA, REPUBLIC OF |
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Correspondence name and address
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SKJERVEN, MORRILL, MACPHERSON ET AL.
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ALAN H. MACPHERSON
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25 METRO DRIVE, SUITE 700
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SAN JOSE, CA 95110
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