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Reel/Frame:	061975/0605			Pages:	3
		Recorded:	11/21/2022
Attorney Dkt #:	30100-10165766P 1446006
Conveyance:	CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).

Total properties: 14

Patent #:	7682937	Issue Dt:	03/23/2010	Application #:	11286432	Filing Dt:	11/25/2005
Publication #:	US20070123061	Pub Dt:	05/31/2007
Title:	METHOD OF TREATING A SUBSTRATE, METHOD OF PROCESSING A SUBSTRATE USING A LASER BEAM, AND ARRANGEMENT

Patent #:	9592574	Issue Dt:	03/14/2017	Application #:	13764406	Filing Dt:	02/11/2013
Publication #:	US20130217153	Pub Dt:	08/22/2013
Title:	METHOD AND APPARATUS FOR SCRIBING A SUBSTANTIALLY PLANAR SEMICONDUCTOR SUBSTRATE WITH ON-THE-FLY CONTROL OF SCRIBING ALIGNMENT

Patent #:	8785298	Issue Dt:	07/22/2014	Application #:	13796384	Filing Dt:	03/12/2013
Publication #:	US20130244404	Pub Dt:	09/19/2013
Title:	METHOD OF SINGULATING A THIN SEMICONDUCTOR WAFER

Patent #:	9120178	Issue Dt:	09/01/2015	Application #:	14165029	Filing Dt:	01/27/2014
Publication #:	US20140213043	Pub Dt:	07/31/2014
Title:	METHOD OF RADIATIVELY GROOVING A SEMICONDUCTOR SUBSTRATE

Patent #:	9449877	Issue Dt:	09/20/2016	Application #:	14488675	Filing Dt:	09/17/2014
Publication #:	US20160079118	Pub Dt:	03/17/2016
Title:	METHOD OF PROTECTING A MOUNTING TAPE DURING LASER SINGULATION OF A WAFER

Patent #:	10096498	Issue Dt:	10/09/2018	Application #:	14513945	Filing Dt:	10/14/2014
Publication #:	US20150104956	Pub Dt:	04/16/2015
Title:	ADJUSTABLE SPATIAL FILTER FOR LASER SCRIBING APPARATUS

Patent #:	10307867	Issue Dt:	06/04/2019	Application #:	14533204	Filing Dt:	11/05/2014
Publication #:	US20160121426	Pub Dt:	05/05/2016
Title:	LASER FIBER ARRAY FOR SINGULATING SEMICONDUCTOR WAFERS

Patent #:	9312178	Issue Dt:	04/12/2016	Application #:	14749920	Filing Dt:	06/25/2015
Publication #:	US20160013105	Pub Dt:	01/14/2016
Title:	METHOD OF DICING THIN SEMICONDUCTOR SUBSTRATES

Patent #:	10340170	Issue Dt:	07/02/2019	Application #:	15043031	Filing Dt:	02/12/2016
Publication #:	US20170236738	Pub Dt:	08/17/2017
Title:	METHOD AND DEVICE FOR GROOVING WAFERS

Patent #:	10134650	Issue Dt:	11/20/2018	Application #:	15048201	Filing Dt:	02/19/2016
Publication #:	US20170243796	Pub Dt:	08/24/2017
Title:	APPARATUS AND METHOD FOR CUTTING A WAFER THAT IS SUBSTANTIALLY COVERED BY AN OPAQUE MATERIAL

Patent #:	9786562	Issue Dt:	10/10/2017	Application #:	15095520	Filing Dt:	04/11/2016
Publication #:	US20160315010	Pub Dt:	10/27/2016
Title:	METHOD AND DEVICE FOR CUTTING WAFERS

Patent #:	11322374	Issue Dt:	05/03/2022	Application #:	15248282	Filing Dt:	08/26/2016
Publication #:	US20170062247	Pub Dt:	03/02/2017
Title:	OPTICAL STATION FOR EXCHANGING OPTICAL ELEMENTS

Patent #:	11121115	Issue Dt:	09/14/2021	Application #:	16136466	Filing Dt:	09/20/2018
Publication #:	US20200098722	Pub Dt:	03/26/2020
Title:	Y-THETA TABLE FOR SEMICONDUCTOR EQUIPMENT

Patent #:	10615044	Issue Dt:	04/07/2020	Application #:	16163767	Filing Dt:	10/18/2018
Publication #:	US20200126800	Pub Dt:	04/23/2020
Title:	MATERIAL CUTTING USING LASER PULSES

Assignor

Exec Dt:

07/25/2022

Assignee

2 YISHUN AVENUE 7

SINGAPORE 768924, SINGAPORE

Correspondence name and address
	DANIEL M. GURFINKEL
	DENNEMEYER & ASSOCIATES, LLC
	2 NORTH RIVERSIDE PLAZA, SUITE 1500
	CHICAGO, IL 60606

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