Patent Assignment Details
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Reel/Frame: | 018140/0608 | |
| Pages: | 5 |
| | Recorded: | 08/04/2006 | | |
Attorney Dkt #: | 01401121 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/19/2013
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Application #:
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11499285
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Filing Dt:
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08/04/2006
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Publication #:
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Pub Dt:
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10/18/2007
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Title:
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Overmolded semiconductor package with a wirebond cage for EMI shielding
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Assignee
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5221 CALIFORNIA AVENUE |
IRVINE, CALIFORNIA 92617 |
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Correspondence name and address
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MICHAEL FARJAMI, ESQ.
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FARJAMI & FARJAMI LLP
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26522 LA ALAMEDA AVE., SUITE 360
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MISSION VIEJO, CALIFORNIA 92691
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