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Reel/Frame:031431/0610   Pages: 3
Recorded: 10/18/2013
Attorney Dkt #:T5057-R359UA
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
08/12/2014
Application #:
14057045
Filing Dt:
10/18/2013
Publication #:
Pub Dt:
02/13/2014
Title:
SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTURE AND METHOD OF FORMING THE SAME
Assignors
1
Exec Dt:
01/13/2011
2
Exec Dt:
01/13/2011
3
Exec Dt:
01/13/2011
Assignee
1
NO. 8, LI-HSIN RD. VI
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300
Correspondence name and address
LOWE HAUPTMAN & HAM, LLP (TSMC)
2318 MILL ROAD
SUITE 1400
ALEXANDRIA, VA 22314

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