Patent Assignment Details
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| Reel/Frame: | 057280/0611 | |
| Pages: | 4 |
| | Recorded: | 08/25/2021 | | |
| Attorney Dkt #: | Q58621VN04 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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06/04/2024
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Application #:
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17411144
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Filing Dt:
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08/25/2021
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Publication #:
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Pub Dt:
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03/03/2022
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Title:
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CIRCUIT PREARRANGED HEAT DISSIPATION EMBEDDED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
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Assignee
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| FPC FACTORY, 3209 NORTH ZHUFENG AVENUE, DOUMEN, ZHUHAI, |
| GUANGDONG, CHINA 519175 |
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Correspondence name and address
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THE PL LAW GROUP, PLLC
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13800 COPPERMINE ROAD
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FL 1-3
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HERNDON,, VA 20171
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