Patent Assignment Details
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Reel/Frame: | 062526/0611 | |
| Pages: | 5 |
| | Recorded: | 01/27/2023 | | |
Attorney Dkt #: | Q240795 |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE IS SAMSUNG ELECTRONICS CO., LTD. AND DONG WON SHIN PREVIOUSLY RECORDED AT REEL: 046381 FRAME: 0808. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/18/2023
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Application #:
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16038348
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Filing Dt:
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07/18/2018
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Publication #:
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Pub Dt:
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01/24/2019
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Title:
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BONDING INTERPOSER AND INTEGRATED CIRCUIT CHIP, AND ULTRASOUND PROBE USING THE SAME
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Assignees
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129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO |
SUWON-SI, KOREA, REPUBLIC OF 16677 |
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201-702, 23, MUNHWA-RO, NAM-GU |
INCHEON, KOREA, REPUBLIC OF 22241 |
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Correspondence name and address
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SUGHRUE MION, PLLC
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2000 PENNSYLVANIA AVENUE NW
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SUITE 900
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WASHINGTON, DC 20006
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